可靠度科學技術研究中心 CREST, Chang Gung University > 刊物 Publication > 會議論文 Conference Paper > 陳始明 Dr. Tan, Cher Ming > 3D circuit model for 3D IC reliability study (invited) 3D circuit model for 3D IC reliability study (invited)陳始明 Dr. Tan, Cher Ming, 會議論文 Conference Paper, 刊物 Publication C. M. Tan and F. He. “3D circuit model for 3D IC reliability study (invited),” in EuroSIME, 2009.
