A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints

Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, J. Wei, L.Y. Xu, S.R. Zhang, 2009, ”A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints,” Journal of Physics D: Applied Physics, v 42, n 12.

回到頂端