A new method for deposition of cubic Ta diffusion barrier for Cu metallization

Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, L. J. Tang, and C. M. Tan. “A new method for deposition of cubic Ta diffusion barrier for Cu metallization,” Thin Solid Films, vol. 434, no. 1-2, pp. 126-129, 2003
https://www.sciencedirect.com/science/article/pii/S0040609003005327

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