A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT)

C. M. Tan and K. N. C. Yeo. “A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT),” Journal of Electronic Testing-Theory and Applications, vol. 17, no. 1, pp. 63-68, 2001
https://link.springer.com/article/10.1023/A:1011102127642

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