Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes

S. M. L Nai, Y. D. Han, H. Y. Jing, L. Y. Xu, C. M. Tan, and J. Wei. “Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes,” in IEEE Electronics Packaging Technology Conf., 2010.

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