Barrier layer effects on reliabilities of copper metallization

Z. W. Yang, D. H. Zhang, C. Y. Li, C. M. Tan, and K. Prasad. “Barrier layer effects on reliabilities of copper metallization,” Thin Solid Films, vol. 462-463, pp. 288, 2004
https://www.sciencedirect.com/science/article/pii/S0040609004006455

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