Changing Reliability Physics of Interconnect from Micro- to Nanotechnology

Tan Cher Ming and Hou Yuejin. “Changing Reliability Physics of Interconnect from Micro- to Nanotechnology”, Ceramic Integration and Joining Technologies: From Macro to Nanoscale, John Wiley, 2010.

https://www.intechopen.com/books/simulated_annealing/simulated_annealing_for_mixture_distribution_analysis_and_its_applications_to_reliability_testing

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