Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding

C. M. Tan, W. Yu, and W. Jun. “Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding,” Applied Physics Letters, vol. 88, no. 11, pp. 114102, 2006
https://aip.scitation.org/doi/full/10.1063/1.2185467

回到頂端