Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes

Y. D. Han*, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei, “Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes,” Journal of Materials Science: Materials in Electronics, vol. 23, no. 5, pp. 1108-1115, May, 2012
https://link.springer.com/article/10.1007/s10854-011-0557-9

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