Current crowding effect on copper dual damascene via bottom failure for ULSI applications

C. M. Tan, A. Roy, A. V. Vairagar, A. Krishnamoorthy, and S. G. Mhaisalkar. “Current crowding effect on copper dual damascene via bottom failure for ULSI applications,” IEEE Trans. on Device and Materials Reliability, vol. 5, no. 2, pp. 198, 2005
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1458734

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