Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes

Y. D. Han*, S. M. L. Nai, H. Y. Jing, L. Y. Xu, C. M. Tan, and J. Wei, “Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes,” Journal of Materials Science: Materials in Electronics, vol. 22, pp. 315-322, 2011
https://link.springer.com/article/10.1007/s10854-010-0135-6

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