Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling

W. Li, C. M. Tan, and Y. Hou. “Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling,” Journal of Applied Physics, vol. 101, no. 10, pp. 104314, 2007
https://aip.scitation.org/doi/full/10.1063/1.2723869

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