Effect of current crowding on copper dual damascene via bottom failure for ULSI applications

A. Roy, C. M. Tan, V. V. Anand, K. Ahila, G. Zhang, and M. G. Subodh. “Effect of current crowding on copper dual damascene via bottom failure for ULSI applications,” in Int. Symp. on Physical and Failure Analysis of Integrated Circuits, 2004.

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