Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures

A. Roy, C. M. Tan, R. Kumar, and X. T. Chen. “Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures,” Microelectronics Reliability, vol. 45, no. 9-11, pp. 1443-1448, 2005
https://www.sciencedirect.com/science/article/pii/S0026271405001939

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