Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects

C. M. Tan, A. Roy, K. T. Tan, D. S. K. Ye, and F. Low. “Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects,” in European Symp. on Reliability of Electron Devices, Failure physics and Analysis, 2005.

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