Electromigration performance of through silicon via (TSV) – A modeling approach

Y. C. Tan, C. M. Tan, X. W. Zhang, T. C. Chai, and D. Q. Yu, “Electromigration performance of through silicon via (TSV) – A modeling approach,” Microelectronics Reliability, vol. 50, no. 9, pp. 1336-1340, 2010
https://www.sciencedirect.com/science/article/pii/S0026271410002970

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