Electromigration reliability of interconnections in RF low noise amplifier circuit

F. He and C. M. Tan. “Electromigration reliability of interconnections in RF low noise amplifier circuit,” Microelectronics Reliability, vol. 52, no. 2, pp. 446-454, Feb. 2012
https://www.sciencedirect.com/science/article/pii/S0026271411004513

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