Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab

W. Li and C. M. Tan. “Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab,” Microelectronics Reliability, vol. 47, no. 9-11, pp. 1497-1501, 2007
https://www.sciencedirect.com/science/article/pii/S0026271407003186

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