Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect

A. Roy and C. M. Tan. “Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect,” Microelectronics Reliability, vol. 46, no. 9-11, pp. 1652-1656, 2006
https://www.sciencedirect.com/science/article/pii/S0026271406002344

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