Failure analysis of bond pad metal peeling using FIB and AFM

C. M. Tan, E. Er, Y. Hua, and V. Chai. “Failure analysis of bond pad metal peeling using FIB and AFM,” IEEE Transactions on Components and Packaging Technologies, vol. 21, no. 4, pp. 585-591, 1998
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=740051

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