Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing

G. Huang, C.M. Tan, Z. Gan, W. Jun, G. Zhang, W. Yu,Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing,” in  Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743), p 189-92, 2004

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