Fracture Toughness Assessment of a solder joint using double cantilever beam specimens

P. Cheng, A. Lee, Z. X. Lim, N. Yantara, S. Z. Y. Loo, T. Y. Tee, C. M. Tan and Z. Chen. “Fracture Toughness Assessment of a solder joint using double cantilever beam specimens,” in IEEE Electronics Packaging Technology Conf., Singapore, 2008.

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