Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes

Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei. “Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes,” in IEEE Int. Nanoelectronic Conf., Hong Kong , 2010, pp. 292-295.

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