Indentation size effect on the creep behavior of a SnAgCu solder

Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei., 2010, “Indentation size effect on the creep behavior of a SnAgCu solder,” International Journal of Modern Physics B, vol. 24, no. 1-2, pp. 267-275.

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