Influence of applied load on vacuum wafer bonding at low temperature

W. B. Yu, C. M. Tan, J. Wei, S. S. Deng, and S. M. L. Nai. “Influence of applied load on vacuum wafer bonding at low temperature,” Sensors and Actuators A-Physical, vol. 115, no. 1, pp. 67-72, 2004
https://www.sciencedirect.com/science/article/pii/S0924424704001797

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