Inkjet-Printed Vertical Interconnects for Ultrathin System-on-package Technology

C.-L. Cho, H.-L. Kao*, L.-C. Chang, Y.-H. Wu, and H.-C. Chiu, “Inkjet-Printed Vertical Interconnects for Ultrathin System-on-package Technology,” Surface and Coatings Technology, vol. 359, 2019, pp. 85-89. 2019/2/1

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