Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects

C. M. Tan and A. Roy. “Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects,” Thin Solid Films, vol. 504, no. 1-2, pp. 288-293, 2006
https://www.sciencedirect.com/science/article/pii/S0040609005016287

回到頂端