Mathematical model for low-temperature wafer bonding under medium vacuum and its application

W. B. Yu, J. Wei, and C. M. Tan. “Mathematical model for low-temperature wafer bonding under medium vacuum and its application,” IEEE Transactions on Advanced Packaging, vol. 28, no. 4, pp. 650-658, 2005.
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1528649

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