Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model

F. He and C. M. Tan. “Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model,” Microelectronics Reliability, vol. 50, pp. 1327-1331, 2010
https://www.sciencedirect.com/science/article/pii/S0026271410003847

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