Moisture Resistance Evaluation on Single Electronic Package Moulding Compound

C. M. Tan, U. Narula, G. L. Seow, V. Sangwan, C. H. Chen, S. P. Lin, and J. Y. Chen, “Moisture Resistance Evaluation on Single Electronic Package Moulding Compound”, Journal of Materials Chemistry C, 2020, DOI:10.1039/C9TC04298A
Moisture resistance evaluation on single electronic package moulding compound – Journal of Materials Chemistry C (RSC Publishing) DOI:10.1039/C9TC04298A

回到頂端