Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability Evaluation

J. M. Chan, C. M. Tan, K. C. Lee, W. Kanert, C. S. Tan, “Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability Evaluation”, International Conference on Materials for Advanced Technologies, Singapore, 28 June, 2015.

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