Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation

M. Chan, C. M. Tan, K. C. Lee, C. S. Tan, “Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation, “ Microelectronics Reliability, Vol. 61, pp. 56-63, June, 2016.
https://www.sciencedirect.com/science/article/pii/S0026271415302730

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