Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist

C. M. Tan, T. C. Chai, J. Lim, and K. P. Lim. “Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist,” in European Symp. on Reliability of Electron Devices, Failure physics and Analysis, 2005.

回到頂端