Non-destructive void size determination in copper metallization under passivation

Z. Gan, C. M. Tan, and G. Zhang. “Non-destructive void size determination in copper metallization under passivation,” IEEE Transactions on Device and Materials Reliability, vol. 3, no. 3, pp. 69-78, 2003
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1229714

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