Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules

P. Singh, D. H. Yeh, C. M. Tan, C.S. Lai, C. T. Hou, T. Y. Chao, and L.B. Chang, “Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules”, Applied Sciences, Vol. 6, no. 179, pp. 1-8, June 2016.
https://www.mdpi.com/2076-3417/6/6/179/htm

回到頂端