Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure

A. Roy and C. M. Tan. “Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure,” Thin Solid Films, vol. 515, no. 7-8, pp. 3867-3874, 2007
https://www.sciencedirect.com/science/article/pii/S0040609006012508

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