Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test

Cher Ming Tan and Udit Narula, “Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test”, 2014 12th IEEE International Conference on Solid State and Integrated Circuits Technology(ICSICT), Guilin, China, 28-31 Oct., 2014, pp.1-7.  Doi: 10.1109/ICSICT.2014.7021168

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