Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay

K. Ghosh, J. Zhang, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan, “Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay,” in Int. Microsystems, Packaging, Assembly Circuits Technology Conf., Taipei, Taiwan, 24-26th Oct. 2012.

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