Stress migration reliability of wide Cu interconnects with Gouging Vias

Y. K. Lim, A. Roy, K. L. Pey, C. M. Tan, C. S. Seet, T. J. Lee, and D. Vigar. “Stress migration reliability of wide Cu interconnects with Gouging Vias,” in Int. reliability physics Symp., 2005, pp. 203.

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