Temperature and stress distribution in the SOI structure during fabrication

C. M. Tan, Z. Gan, and X. Gao. “Temperature and stress distribution in the SOI structure during fabrication,” IEEE Transactions on Semiconductor Manufacturing, vol. 16, no. 2, pp. 314-318, 2003
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1198045

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