Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Y.D. Han*, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, 2010, February, Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder,”  Journal of Electronic Materials, v 39, n 2, p 223-229.

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