Thermally induced stress in partial SOI structure during high temperature processing

Z. Gan and C. M. Tan. “Thermally induced stress in partial SOI structure during high temperature processing,” Microelectronic Engineering, vol. 71, no. 2, pp. 150-162, 2004
https://www.sciencedirect.com/science/article/pii/S016793170300529X

回到頂端