Using nanoparticles and carbon nanotubes to enhance the properties of a lead free solder

S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, and J. Wei. “Using nanoparticles and carbon nanotubes to enhance the properties of a lead free solder,” in 12th Nanotechnology Conf. & Expo, USA, 2009, pp. 538-541.

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